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Dr. Alexander Rensink

Dr. Alexander Rensink

Senior Account Director,
TSMC Europe B.V.

Agenda 2024, DAY 1

Key Considerations for Chiplet Based Advanced Packaging

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NOVEMBER 2024 & MARCH 2025
MUNICH (GER) I DETROIT (US)
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- DAY 1 (2024-11-18)
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CONTACT
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